Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line

Product Details
Customization: Available
Application: Automotive Industry, Electronics Industry, Semi-Conductor Industry
Coating Type: Adhesive Coating
Manufacturer/Factory & Trading Company
Gold Member Since 2025

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  • Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
  • Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
  • Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
  • Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
  • Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
  • Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
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  • Overview
  • Product Description
  • Our Advantages
  • Company Profile
Overview

Basic Info.

Model NO.
IGBT Production Line
Heating system
Tunnel Type Multi-Layer Curing Oven
Warranty
Online Service
Power
3.5 Kw
Voltge
380V
Air Pressure
0.3-0.6 MPa
Min. Output Volume
0.3ml
Transport Package
Wooden Case
Specification
According to customer
Trademark
HOLS
Origin
Jiangsu, China

Product Description

Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
Product Description

Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line

Product name: IGBT Dispensing and Curing Assembly Line
Product brand: HOLS
Product size: Please contact our dedicated customer service team for details.
Applicable industry: Pioneering solutions for New Energy Vehicles, Semiconductors, and Healthcare sectors

Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line Working process: Seamlessly retrieve product from the preceding workstation → Enter high-temperature oven for premium curing → Proceed to cooling furnace for rapid temperature reduction → Engage in automatic cleaning and dust removal → Carry out precision vacuum dispensing → Return to high-temperature oven for optimal curing → Transition to cooling furnace → Advance product to subsequent stage

The IGBT module is indispensable across various sectors, such as rail transit, photovoltaic power generation, and automotive electronics, serving as the leading-edge switching device. With the advent of new energy vehicles, there is a burgeoning demand for IGBTs that deliver exceptional power processing capabilities while minimizing power consumption and heat generation to enhance vehicle performance. As a pivotal element in power electronics, the IGBT's reliability is crucial for ensuring the safe operation of entire systems, necessitating advanced packaging technologies. The packaging process encompasses screen printing, mounting, bonding, and functional testing, each requiring sophisticated technology and equipment to achieve excellence.
Curing applications are extensively utilized across various industries. Depending on specific production needs, either a batch oven or conveyor oven can be deployed. Curing involves applying heat to induce a chemical reaction, securing a finish or adhesive, or solidifying plastics or epoxies, resulting in a robust, resilient material or coating that withstands temperature, humidity, and corrosion. Industrial curing ovens are designed to deliver superior temperature uniformity, ensuring each component receives the optimal cure for longevity and effectiveness.

 
Our Advantages
Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line

Key Advantages:
1. Degassing technique: Low-viscosity materials self-degas effectively; for high-viscosity products, the use of vacuum degassing accelerates the process significantly.
2. Vacuum potting technology: This innovative technology prevents air inclusion; operating in a vacuum environment enhances the performance of the final product.
3. Significant reduction of voids: Our meticulously designed production line and processes are engineered to minimize voids, thereby optimizing product performance.

Application:
Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line
Company Profile

Fully Automated IGBT Power Module Packaging Line Automated Encapsulation LineFully Automated IGBT Power Module Packaging Line Automated Encapsulation LineFully Automated IGBT Power Module Packaging Line Automated Encapsulation Line

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Fully Automated IGBT Power Module Packaging Line Automated Encapsulation Line

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