Power Module Packaging IGBT Power Module Encapsulation Production Line

Product Details
Customization: Available
Application: Automotive Industry, Electronics Industry, Semi-Conductor Industry
Coating Type: Adhesive Coating
Manufacturer/Factory & Trading Company
Gold Member Since 2025

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  • Power Module Packaging IGBT Power Module Encapsulation Production Line
  • Power Module Packaging IGBT Power Module Encapsulation Production Line
  • Power Module Packaging IGBT Power Module Encapsulation Production Line
  • Power Module Packaging IGBT Power Module Encapsulation Production Line
  • Power Module Packaging IGBT Power Module Encapsulation Production Line
  • Power Module Packaging IGBT Power Module Encapsulation Production Line
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  • Overview
  • Product Description
  • Our Advantages
  • Company Profile
Overview

Basic Info.

Model NO.
IGBT Production Line
Heating system
Tunnel Type Multi-Layer Curing Oven
Warranty
Online Service
Power
3.5 Kw
Voltge
380V
Air Pressure
0.3-0.6 MPa
Min. Output Volume
0.3ml
Transport Package
Wooden Case
Specification
According to customer
Trademark
HOLS
Origin
Jiangsu, China

Product Description

Power Module Packaging IGBT Power Module Encapsulation Production Line
Product Description

Power Module Packaging IGBT Power Module Encapsulation Production Line

Product name: IGBT Dispensing and Curing Assembly Line
Product brand: HOLS
Product size: For precise dimensions and specifications, please contact our dedicated customer service team.
Appliable industry: Perfectly suited for the dynamic sectors of New energy vehicles, cutting-edge Semiconductor technology, and advanced Healthcare applications.

Power Module Packaging IGBT Power Module Encapsulation Production Line Working process: Seamlessly integrated operations start with acquiring the product from the preceding workstation, followed by an entrance into the high-temperature oven for meticulous curing. This process is succeeded by a cooling furnace phase to rapidly bring down the product's temperature, ensuring optimal conditions for the next step. The system then engages in thorough automatic cleaning and dust removal before proceeding to precision vacuum dispensing. Another round of high-temperature oven curing solidifies the process, moving subsequently to the cooling furnace. Finally, the product transitions smoothly to the next stage of production.

The IGBT module is a pivotal component in applications ranging from rail transit to photovoltaic power generation and automotive electronics. It's recognized as the leading current switching device. In new energy vehicles, IGBTs must deliver robust and efficient power processing capabilities while minimizing excessive power consumption and unwanted heat generation. This enhances the vehicle's overall performance. As a core device in power electronics, IGBT's reliability is vital for ensuring safe operations. This demands superior packaging, which includes intricate procedures such as screen printing, mounting, bonding, and functional testing. Each of these steps, though seemingly straightforward, requires advanced packaging technology and equipment for successful execution.
Curing applications are indispensable across numerous industries, utilizing batch or conveyor ovens to meet diverse production needs. The curing process employs heat to instigate a chemical reaction, effectively applying a finish or adhesive, or solidifying materials like plastic or epoxy. The final product is a robust, stable material or coating capable of resisting temperature fluctuations, humidity, and corrosion. Our industrial curing ovens deliver exceptional temperature uniformity, ensuring each part achieves an optimal cure, enhancing durability and performance.

 
Our Advantages
Power Module Packaging IGBT Power Module Encapsulation Production Line
Power Module Packaging IGBT Power Module Encapsulation Production Line

Advantages:
1. Degassing technique: For low viscosity materials, self-degassing occurs seamlessly, while high viscosity products benefit from expedited vacuum degassing, ensuring optimal results.
2. Vacuum potting technology: Specifically designed to prevent air introduction; operating in a vacuum environment enhances product performance by maintaining the integrity of the finished product.
3. Effectively reduce voids: Our ingeniously designed production line and methodical working process significantly diminish voids, thereby enhancing the overall performance of the products.

Application:
Power Module Packaging IGBT Power Module Encapsulation Production Line
Company Profile

Power Module Packaging IGBT Power Module Encapsulation Production LinePower Module Packaging IGBT Power Module Encapsulation Production LinePower Module Packaging IGBT Power Module Encapsulation Production Line

Worldwide office distribution

Power Module Packaging IGBT Power Module Encapsulation Production Line

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