Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging

Product Details
Customization: Available
Application: Automotive Industry, Electronics Industry, Semi-Conductor Industry
Coating Type: Adhesive Coating
Manufacturer/Factory & Trading Company
Gold Member Since 2025

Suppliers with verified business licenses

Audited Supplier Audited Supplier

Audited by an independent third-party inspection agency

Importers and Exporters
The supplier has import and export rights
Management Certification
The supplier has quality management system certification, including:
ISO9001:2015 certificate
Standardized quality control
The supplier has a complete and standardized quality control process, check the Audit Report for more information
Full Customization
The supplier provides full customization services
to see all verified strength labels (28)
  • Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
  • Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
  • Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
  • Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
  • Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
  • Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
Find Similar Products
  • Overview
  • Product Description
  • Our Advantages
  • Company Profile
Overview

Basic Info.

Model NO.
IGBT Production Line
Heating system
Tunnel Type Multi-Layer Curing Oven
Warranty
Online Service
Power
3.5 Kw
Voltge
380V
Air Pressure
0.3-0.6 MPa
Min. Output Volume
0.3ml
Transport Package
Wooden Case
Specification
According to customer
Trademark
HOLS
Origin
Jiangsu, China

Product Description

Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
Product Description

Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging

Product name: IGBT Dispensing and Curing Assembly Line
Product brand: HOLS
Product size: Please contact customer service for detailed dimensions and specifications tailored to your needs.
Applicable industries: This versatile module excels in sectors like New Energy Vehicles, Semiconductor, and Healthcare, providing cutting-edge solutions for dynamic markets.

Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging Working process: Seamless integration starts with obtaining the product from the previous workstation, followed by high-temperature oven curing. Rapid cooling in a furnace promptly reduces temperature, then automatic cleaning and dust removal prepare the product for vacuum dispensing. Another high-temperature oven curing step is followed by a transition to the cooling furnace before the product advances to the next stage of production.

The IGBT module is a pivotal component across diverse applications, including rail transit, photovoltaic power generation, and automotive electronics, serving as the foremost switching device in today's technology landscape. In new energy vehicles, there's an imperative for IGBTs to deliver robust and efficient power processing capabilities, minimizing power consumption and excess heat to enhance vehicle performance. As a cornerstone of power electronics, IGBT reliability is crucial for the safe operation of the entire device, thus demanding advanced packaging solutions. Key processes in IGBT packaging-screen printing, mounting, bonding, functional testing-require sophisticated technology and precision equipment, underscoring the module's critical role.
Curing applications are integral across numerous industries, utilizing batch ovens or conveyor ovens tailored to specific production needs. These applications leverage heat to facilitate chemical reactions that cure finishes or adhesives on products, or to solidify plastics or epoxies. The outcome is a durable, resilient material or coating resistant to temperature, humidity, and corrosion, enhanced by industrial curing ovens that ensure exceptional temperature uniformity for optimal curing results.

 
Our Advantages
Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging

Advantages:
1. Degassing technique: For materials with low viscosity, natural self-degassing occurs efficiently, while vacuum degassing accelerates the process for high viscosity products, ensuring purity and quality.
2. Vacuum potting technology: This advanced technique prevents air infiltration by maintaining a vacuum environment, thereby enhancing the final product's performance and integrity.
3. Effectively reduce voids: Our production line's innovative design and operational excellence significantly reduce voids, elevating the overall performance and quality of our products.

Application:
Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging
Company Profile

Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module PackagingEpoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module PackagingEpoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging

Worldwide office distribution

Epoxy Resin Encapsulated IGBT Module High-Voltage Sic Power Module Packaging

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier